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1、P,*,/P139,印刷電路板字彙,*,電路板(,PCB,),字彙整理,教 育 訓(xùn) 練 教 材,僅 供 內(nèi) 部 使 用 嚴(yán) 禁 翻 印 (200,2,.0,7,.0,1,),PCB,字典,UNiC,2024/11/28,0,,,流 程 圖,PCB Mfg. FLOW CHART,UPDATED:1999,09,01,多層板內(nèi)層流程,,(,INNER LAYER PRODUCT,),多次埋孔,,Multiple Buried Via,徐 振 連,JOHNNY HSU,顧 客 (,CUSTOMER,),工 程 製 前,,(,FRONT-END DEP.,),裁

2、 板,,(,LAMINATE SHEAR,),內(nèi) 層 乾 膜 (,INNERLAYER IMAGE,),預(yù) 疊 板 及 疊 板 (,LAY- UP,),通 孔 電 鍍,,(,P . T . H .,),液 態(tài) 防 焊,,(,LIQUID S/M,),外 觀 檢 查,,(,VISUAL INSPECTION,),成 型,,(,FINAL SHAPING,),業(yè) 務(wù),,(,SALES DEPARTMENT,),生 產(chǎn) 管 理,,(,P&M CONTROL,),蝕

3、 銅,,(,I/L ETCHING,),鑽 孔,,(,PTH DRILLING,),壓 合 (,LAMINATION,),外 層 乾 膜 (,OUTERLAYERIMAGE,),二次銅及錫鉛電鍍,,(,PATTERN PLATING,),,蝕 銅,,(,O/L ETCHING,),檢 查 (,INSPECTION,),,,噴 錫,,(,HOT AIR LEVELING,),電 測(cè) (,ELECTRICA

4、L TEST,),,出 貨 前 檢 查,,(,O. Q. C.,),包 裝 出 貨 (,PACKING&SHIPPING,),曝 光 (,EXPOSURE,),壓 膜 (,LAMINATION,),前處理 (,PRELIMINARY,,TREATMENT,),顯 影 (,DEVELOPIG,),,蝕 銅 (,ETCHING,),去 膜 (,STRIPPING,),,黑 化 處 理,,(,BLACK OXIDE,),,烘 烤 (,BAKING,

5、),預(yù) 疊 板 及 疊 板 (,LAY- UP,),壓 合 (,LAMINATION,),後 處 理 (,POSTTREATMENT,),,曝 光 (,EXPOSURE,),,壓 膜(,LAMINATION,),二 次 銅 電 鍍 (,PATTERNPLATING,),錫 鉛 電 鍍,,(,T/L PLATING,),,去 膜 (,STRIPPING,),,蝕 銅 (,ETCHING,),剝 錫 鉛,,(,T/L STRIPPING,),,,,塗 佈 印 刷,,,(,S/M COATING,)

6、,預(yù) 乾 燥,,,(,PRE-CURE,),,曝 光 (,EXPOSURE,),顯 影 (,DEVELOPING,),後 烘 烤,,(,POST CURE,),MLB,全 板 電 鍍,,(,PANEL PLATING,),銅 面 防 氧 化 處 理,,O.S.P (,Entek,Cu 106A,),,外 層 製 作,,(,OUTER-LAYER,),TENTING,PROCESS,鍍 金 手指,,(,G/F PLATING,),鍍 化 學(xué) 鎳 金,,(,E-less Ni/Au,),For O. S. P.,選 擇

7、 性 鍍 鎳 鍍 金 (,SELECTIVE GOLD,),印 文 字,,(,SCREEN LEGEND,),,,,網(wǎng) 版 製 作 (,STENCIL,),,圖 面 (,DRAWING,),工 作 底 片 (,WORKING A/W,),製 作 規(guī) 範(fàn),,(,RUN CARD,),程 式 帶 (,PROGRAM,),鑽 孔 , 成 型 機(jī) (,D. N. C.,),,,底 片,(,MASTER A/W,),磁 片, 磁 帶,,(,DISK , M/T,),藍(lán) 圖,(,DRAWING,),資 料 傳

8、 送,,,(,MODEM , FTP,),,A O I,檢 查,,(,AOI INSPECTION,),除 膠 渣 (,DESMER,),,通 孔 電 鍍,,,(,E-LESS CU,),DOUBLE,,SIDE,前處理 (,PRELIMINARY,,TREATMENT,),前處理 (,PRELIMINARY,,TREATMENT,),前處理 (,PRELIMINARY,,TREATMENT,),全面鍍鎳金,,(,S/G PLATING,),雷 射 鑽 孔,,(,LASER,,ABLATION,),Blinded Via,埋 孔 鑽 孔,,,(,I.V.H. DRILLING,

9、),埋 孔 電 鍍,,(,I.V.H. PLATING,),埋孔(,Buried via),P1/136,2024/11/28,1,,*,Process Module,說明,:,,,,,A.,下料,(,Cut Lamination),,a-1,裁板,(,Sheets Cutting),,a-2,原物料發(fā)料,(,Panel)(Shear material to Size),,,,,B.,鑽孔,(,Drilling),,b-1,內(nèi)鑽,(,Inner Layer Drilling ),,b-2,一次孔,(,Outer Layer Drilling ),,,b-3,二次孔,(2,nd,Drillin

10、g),,,b-4,雷射鑽孔,(,Laser Drilling )(Laser Ablation ),,b-5,盲,(,埋,),孔鑽孔,(,Blind & Buried Hole Drilling),,,,C.,乾膜製程,(,Photo Process(D/F)),,,,c-1,前處理,(,Pretreatment),,c-2,壓,,膜,(,Dry Film Lamination),,c-3,曝,,光,(,Exposure),,c-4,顯,,影,(,Developing),,,,c-5,蝕銅,(,Etching),,c-6,去膜,(,Stripping),,c-7,初檢,(,Touch-up),

11、,c-8,化學(xué)前處理,化學(xué)研磨,(,Chemical Milling ),,c,-9,選擇性浸金壓膜,(,Selective Gold Dry Film Lamination),,,c-10,顯 影,(,Developing ),,,,c-11,去膜,(,Stripping ),,,,,D.,壓,,合,,Lamination,,d-1,黑,,化,(,Black Oxide Treatment),,d-2,微,,蝕,(,Microetching,),,,,D,eveloping ,,E,tching &,S,tripping (,DES,),2024/11/28,2,,,d-3,鉚釘組合,(,e

12、yelet ),,d-4,疊板,(,Lay up),,d-5,壓,,合,(,Lamination),,d-6,後處理,(,Post Treatment),,d-7,黑氧化,(,Black Oxide Removal ),,,d-8,銑靶 (,spot face),,d-9,去溢膠,(,resin flush removal),,,E.,減銅,(,Copper Reduction),,e-1,薄化銅,(,Copper Reduction),,,,F.,電鍍,(,Horizontal Electrolytic Plating),,f-1,水平電鍍 (,Horizontal Electro-Plat

13、ing) (Panel Plating),,,f-2,錫鉛電鍍,(,Tin-Lead Plating ) (Pattern Plating),,f-3,低於,1,mil ( Less than 1 mil Thickness ),,f-4,高於,1,mil ( More than 1 mil Thickness),,f-5,砂帶研磨,(,Belt Sanding),,f-6,剝錫鉛,(,Tin-Lead Stripping),,f-7,微切片,(,Microsection,),,,,G.,塞孔,(,Plug Hole),,g-1,印刷,(,Ink Print ),,g-2,預(yù)烤,(,Precu

14、re,),,g-3,表面刷磨,(,Scrub),,g-4,後烘烤,(,Postcure,),,,,H.,防焊,(,綠漆,): (,Solder Mask),,h-1 C,面印刷,(,Printing Top Side),,h-2 S,面印刷,(,Printing Bottom Side),,h-3,靜電噴塗,(,Spray Coating),,h-4,前處理,(,Pretreatment),,h-5,預(yù)烤,(,Precure,),,h-6,曝光,(,Exposure),,h-7,顯影,(,Develop),,h-8,後烘烤,(,Postcure,),2024/11/28,3,,,h-9

15、UV,烘烤,(,UV Cure),,h-10,文字印刷,(,Printing of Legend ),,h-11,噴砂,(,Pumice)(Wet Blasting),,h-12,印可剝離防焊,(,Peelable,Solder Mask),,,,I .,鍍金,,Gold plating,,i-1,金手指鍍鎳金,(,Gold Finger ),,i-2,電鍍軟金,(,Soft Ni/Au Plating),,i-3,浸鎳金,(,Immersion Ni/Au) (,Electroless,Ni/Au),,J.,噴錫,(,Hot Air Solder Leveling),,j-1,水平噴錫,(,

16、Horizontal Hot Air Solder Leveling),,j-2,垂直噴錫,(,Vertical Hot Air Solder Leveling),,j-3,超級(jí)焊錫,(,Super Solder ),,,j-4.,印焊錫突點(diǎn),(,Solder Bump),,,,,K.,成型,(,Profile)(Form),,,,k-1,撈型,(,N/C Routing ) (Milling),,k-2,模具沖,(,Punch),,,k-3,板面清洗烘烤,(,Cleaning & Backing),,k-4 V,型槽,(,V-Cut)(V-Scoring),,k-5,金手指斜邊,(,Be

17、veling of G/F),,,,L.,短斷路測(cè)試,(,Electrical Testing) (Continuity & Insulation Testing),,l-1 AOI,光學(xué)檢查,(,AOI Inspection),,l-2 VRS,目檢,(,Verified & Repaired),,l-3,汎用型治具測(cè)試,(,Universal Tester),,l-4,專用治具測(cè)試,(,Dedicated Tester),,l-5,飛針測(cè)試,(,Flying Probe),,,,M.,終檢,(,Final Visual Inspection),,m-1,壓板翹,(,Warpage,Re

18、move),,m-2 X-OUT,印刷,(,X-Out Marking),,m-3,包裝,,及出貨,(,Packing & shipping),2024/11/28,4,,,,,m-4,目檢,(,Visual Inspection),,,,m-5,清洗,,及烘烤,(,Final Clean & Baking),,,,m-6,護(hù)銅劑 (,ENTEK Cu-106A)(OSP),,,,m-7,離子殘餘量測(cè)試,(,Ionic Contamination Test )(Cleanliness Test),,,,m-8,冷熱衝擊試驗(yàn),(,Thermal cycling Testing),,m-9,焊錫

19、性試驗(yàn),(,Solderability,Testing ),,,,,,N.,雷射鑽孔,(,Laser Ablation),,,,N-1,雷射鑽,Tooling,孔,(,Laser ablation Tooling Hole),,,,N-2,雷射曝光對(duì)位孔,(,Laser Ablation Registration Hole),,,,N-3,雷射,Mask,製作,(,Laser Mask),,,,N-4,雷射鑽孔,(,Laser Ablation),,,,,N-5 AOI,檢查及,VRS,( AOI Inspection & Verified & Repaired),,,,N-6,Blaser

20、,AOI (after,Desmear,and,Microetching,),,,,N-7,除膠渣,(,Desmear,),,,,,N-8,微蝕,(,Microetching,,),,,2024/11/28,5,,A/W (artwork),底片,,Ablation,燒溶,(,laser),,,切除,,,,abrade,粗化,,,abrasion resistance,耐磨性,,,absorption,吸收,,,ACC ( accept ),允收,,,accelerated corrosion test,加速腐蝕,,,accelerated test,加速試驗(yàn),,,acceleration,

21、速化反應(yīng),,,accelerator,加速劑,,,acceptable,允收,,,,activator,活化液,,active work in process,實(shí)際在製品,,,adhesion,附著力,,,adhesive method,黏著法,,,air inclusion,氣泡,,,air knife,風(fēng)刀,,,amorphous change,不定形的改變,,,amount,總量,,,amylnitrite,,硝基戊烷,,,analyzer,分析儀,,,anneal,回火,,,annular ring,環(huán)狀墊圈,;,孔環(huán),,,anode slime (sludge),陽(yáng)極泥,,,ano

22、dizing,陽(yáng)極處理,,,AOI ( automatic optical inspection ),自動(dòng)光學(xué)檢測(cè),,applicable documents,引用之文件,,AQL sampling,允收水準(zhǔn)抽樣,,,aqueous,photoresist,,液態(tài)光阻,,,aspect ratio,縱橫比,(,厚寬比,),,As received,,,到貨時(shí),,,2024/11/28,6,,back lighting,背光,,,back-up,墊板,,,banked work in process,預(yù)留在製品,,,base material,基材,,baseline performance,

23、基準(zhǔn)績(jī)效,,,batch,批,,,beta backscattering,貝他射線照射法,,,beveling,切斜邊,;,斜邊,,biaxial deformation,二方向之變形,,,black-oxide,黑化,,,,blank controller,空白對(duì)照組,,2024/11/28,7,,blank panel,空板,,,blanking,挖空,,,blip,彈開,,,blister,氣泡,;,起泡,,,blistering,氣泡,,,blow hole,吹孔,,,,board-thickness error,板厚錯(cuò)誤,,bonding plies,黏結(jié)層,,,bow ; bowi

24、ng,板彎,,,,break out,從平環(huán)內(nèi)破出,,,,bridging,搭橋,;,橋接,,,BTO (Build To Order),接單生產(chǎn),,,burning,燒焦,,,burr,毛邊,(,毛頭,),,,camcorder,一體型攝錄放機(jī),,,carbide,碳化物,,,carlson,pin,定位梢,,,carrier,載運(yùn)劑,,,catalyzing,催化,,,catholic sputtering,陰極濺射法,,,caul,plate,隔板,;,鋼板,,,calibration system requirements,校驗(yàn)系統(tǒng)之各種要求,,,center beam method,

25、中心光束法,,,central projection,集中式投射線,,certification,認(rèn)證,,,chamfer,倒角,(,金手指,),,,chamfering,切斜邊,;,倒角,,,characteristic impedance,特性阻抗,,,charge transfer,overpotential,,電量傳遞過電壓,,,chase,網(wǎng)框,,,checkboard,,棋盤,,,chelator,,蟹和劑,,,chemical bond,化學(xué)鍵,,,,chemical vapor deposition,化學(xué)蒸著鍍,,,circumferential void,圓周性之孔破,,,,

26、clad metal,包夾金屬,,,clean room,無塵室,,,clearance,間隙,,,,coat,鍍外表,,,coating error,防焊覆蓋錯(cuò)誤,,2024/11/28,8,,coefficient of thermal expansion (CTE),熱澎脹系數(shù),,,,cold solder joint,冷焊點(diǎn),,,cold-weld,金屬粉末冷焊,,,color,顏色,,,color error,顏色錯(cuò)誤,,,compensation,補(bǔ)償,,competitive performance,競(jìng)爭(zhēng)力績(jī)效,,,complex salt,錯(cuò)化物,,,complexor,錯(cuò)化物

27、,,,component hole,零件孔,,,component side,零件面,,,,concentric,同心,,,conformance,密貼性,,consumer products,消費(fèi)性產(chǎn)品,,,contact resistance,接觸電阻,,,continuous performance,連續(xù)發(fā)揮效能,,,contract service,協(xié)力廠,,,,controlled split,均裂式,,,conventional flow,亂流方式,,,conventional tensile test,傳統(tǒng)張力測(cè)試法,,,conversion coating,轉(zhuǎn)化層,,,conv

28、ex,突出,,,coordinate list,資料清單,,,copper,claded,laminates (CCL),銅箔基板,,,,copper exposure,線路露銅,,,copper mirror,鏡銅,,,copper pad,銅箔圓配,,,copper residue (copper splash),銅渣,,,corrosion rate numbering,腐蝕速率計(jì)數(shù)系統(tǒng),,,corrosion resistance,抗蝕性,,,coulombs law,庫(kù)倫定律,,,countersink,喇叭孔,,,coupon,試樣,,,,coupon location,試樣點(diǎn),,

29、covering power,遮蓋力,,,CPU,中央處理器,,,crack,破裂,;,裂痕,,,,crazing,裂痕,;,白斑,,,cross linking,交聯(lián)聚合,,2024/11/28,9,,cross talk,呼應(yīng)作用,,,crosslinking,交聯(lián),,crystal collection,結(jié)晶收集,,,curing,聚合體,,,current efficiency,電流效率,,,cut-outs,挖空,,,cutting,裁板,,,cyanide,氰化物,,cycles of learning,學(xué)習(xí)循環(huán),,,cycle-time reduction,交期縮短,,,date

30、 code,週期,,,deburring,,去毛頭,,,,dedicated,專用型,,,degradation,退變,,,delamination,,分層,,,dent / pin hole,凹陷,/,針孔,,department of defense,國(guó)防部,,designation,字碼簡(jiǎn)示法,,,de-smear,除膠渣,,,developing,顯影,,,,dewetting,,縮錫,,,dewetting,time,縮錫時(shí)間,,,dimension error,外形尺寸錯(cuò)誤,,dielectric constant,介質(zhì)常數(shù),,,,difficulty,困難度,,difunctio

31、nal,,雙功能,,,dimension,尺寸,,,dimension stability,尺寸安定性,,,dimensional stability,尺度安定性,,dimension and tolerance,尺寸與公差,,,dirty hole,孔內(nèi)異物,,,discolor hole,孔黑,;,孔灰,;,氧化,,discoloration,變色,,,disposable eyelet method,消耗性鉚釘法,,,distortion factor,尺寸變形函數(shù),,double side,雙面板,2024/11/28,10,,downtime,停機(jī)時(shí)間,,,drill,鑽孔,,,dr

32、ill bit,鑽頭,,,,drill facet,鑽尖切萷面,,,drill pointer,鑽尖重,(,研,),磨機(jī),,,,drilled blank board,已鑽孔之裸板,,,drilling,鑽孔,,,dry film,乾膜,,,,ductility,延展性,,economy of scale,經(jīng)濟(jì)規(guī)模,,edge spacing,板邊空地,,,edge-board contact ( gold finger ),金手指,,,,efficiency,能量效率,,,electric test,電測(cè),,,electrical testing,電測(cè),;,測(cè)試,,,electrochemi

33、cal machine ECM,電化學(xué)加工法,,,electrochemical reactor,電化學(xué)反應(yīng)器,,,electroforming,電鑄,,,electroless,plate,化學(xué)銅,,,electroless,-deposition,無電鍍,,,electropolishing,,電解拋光,,,electrorefining,,電解精鍊,,,electrowinning,,電解萃取,,,elliptical set,橢圓形,,,embrittlement,,脆性,,,entitlement performance,可達(dá)成績(jī)效,,,entrapment,電鍍夾雜物,,,epox

34、y,環(huán)氧樹酯,,,,equipotential,,電位線,,,error data file,異常情形,,,etch rate,蝕銅速率,,,,etchants,,蝕刻液,,,,etchback,,回蝕,,,evaluation program,評(píng)估用程式,,,,exposure,曝光,,,external pin method,外部插梢法,,,eyelet hole,鉚釘孔,,,Eyeletting,,鉚眼,,,fabric,網(wǎng)布,,,failure,故障,,,2024/11/28,11,,fast response,快速回應(yīng),,fault,瑕庛,;,缺陷,,fiber exposure,纖

35、維顯露,,,fiber protrusion,纖維突出,,,,fiducial,mark,光學(xué)點(diǎn),,,基準(zhǔn)記號(hào),,,filler,填充料,,,film,底片,,,,filtration,過濾,,,finished board,成品,,,,fixing,固著,,,fixture,電測(cè)夾具,(,治具,),,,flaking off,粹離,,,flammability rating,燃性等級(jí),,,,flare,喇叭形孔,,,,flat cable,併排電纜,,feedback loop,回饋循環(huán),,,first-in-first-out (FIFO),先進(jìn)先出,,,flexible manufact

36、uring system (FMS),彈性製造系統(tǒng),,,flux,助焊劑,,,foil distortion,銅層變形,,,,fold,空泡,,,foreign include,,異物,,,foreign material,基材內(nèi)異物,,,,free radical chain polymerization,自由基連鎖聚合,,,fully additive,,加成法,,,fully annealed type,徹底回火軔化之類形,,,function,函數(shù),,fundamental and basic,基本,,fungus resistance,,抗黴性,,,,,funnel flange,喇

37、叭形摺翼,,galvanized,加法尼化製程,,,gap,鑽尖分開,,,,gauge length,有效長(zhǎng)度,,,gel time,,膠化時(shí)間,,,general resist ink,一般阻劑油墨,,general,通論,,,general industrial,一般性,(,電子,),工業(yè)級(jí),,,geometrical,levelling,,幾何平整,,,glass transition temperature (,Tg,),玻璃態(tài)轉(zhuǎn)換溫度,2024/11/28,12,,Gold,金,,,,gold finger,金手指,,,,gold plating,鍍金,,,golden board,

38、標(biāo)準(zhǔn)板,,,,gouges,刷磨凹溝,,,gouging,挖破,,,grain boundary,金屬晶體之四邊,,,green,綠色,,,,grip,夾頭,,,ground plane,接地層,,,ground plane clearance,接地空環(huán),,hackers,駭客,,,HAL ( hot air leveling ),噴錫,,,,haloing,白邊,;,白圈,,,hardener,硬化劑,,,hardness,硬度,,,hepa,filter,空氣濾清器,,high performance industrial,高性能,(,電子,),工業(yè)級(jí),,,high reliability

39、,高可靠度,,,,,high resolution,高解析度,,high temperature elongation (HTE),高溫延展性銅箔,,,high temperature epoxy (HTE),高溫樹酯,,,,hit,擊,,,hole counter,數(shù)孔機(jī),,,hole diameter,孔徑,,,hole diameter error,孔徑錯(cuò)誤,,,hole location,孔位,,,,hole number,孔數(shù),,,hole wall quality,孔壁品質(zhì),,,hook,外弧,,,hot dip,熱浸法,,,hull cell,哈氏槽,,,,hy

40、brid,混成積體電路,,,hydrogen bonding,氫鍵,,,hydrolysis,水解,,,,hydrometallurgy,濕法冶金法,,,image analysis system,影像分析系統(tǒng),,,image transfer,影像轉(zhuǎn)移,,immersion gold,浸金,(,化鎳金,),,2024/11/28,13,,immersion plating,浸鍍法,,,impedance,阻抗,,,infrared,reflow,紅外線重熔,,,inhibitor,熱聚合抑制劑,,,injection mold,射模,,,ink,油墨,,,,innerlayer,&,outl

41、ayer,內(nèi)外層,,,insulation resistance,絕緣電阻,,,intended position,應(yīng)該在的位置,,,intensifier,增強(qiáng)器,,,intensity,強(qiáng)度,,,inter molecular exchange,交互改變,,,interconnection,互相連通,,,ionic contaminants,,離子性污染物,,,,ionic contamination testing,離子污染試驗(yàn),,,IPA,異丙醇,,5,I : inspiration,(,啟蒙),,,,identification,確認(rèn)計(jì)劃目標(biāo),,,,implementation,改善

42、方案,,,,information,數(shù)據(jù),,,,internalization,制度化,,,invisible inventory,無形的庫(kù)存,,,knife edges,刀緣,,,Knoop,,努普,(,硬度單位,),,kraft,paper,牛皮紙,,,,laminar flow,層流,,,laminate,基層板,,,,laminating,壓合,,,lamination,壓合,,,laminator,壓膜機(jī),,,land,焊墊,,,lay back,刃角磨損,,,lay up,組合疊板,,,layout,佈線,;,佈局,,,lead screw,牽引螺絲,,,,leakage,漏電,,

43、learning curve,學(xué)習(xí)曲線,,,,legend,文字標(biāo)記,,,leveling,平整,,2024/11/28,14,,levelling,additive,平整劑,,,levelling,power,平整力,,,life support,維繫生命,,,limiting current,極限電流,,,line space,線距,,,line width,線寬,,,linear variable differential transformer(LVDL),線性可變差動(dòng)轉(zhuǎn)換器,,,liquid,液狀,(,態(tài),),,,liquid crystal resins,液晶樹脂,,,liquid

44、,photoimageable,solder resist ink,液態(tài)感光防焊油墨,,,liquid,photoresist,ink,液態(tài)光阻劑油墨,,,,lot size,批量,,,,lower carrier,底部承載板,,,mechanical plating,機(jī)祴鍍法,,,machine scrub,刷磨清潔法,,,macrothrowing,power,巨分佈力,,,margin,鑽頭刃帶,,market share,市場(chǎng)佔(zhàn)有率,,,,marking error,文字錯(cuò)誤,,,masked leveling,儰裝平整,,,mass lamination,大型壓板,,,,mass t

45、ransfer,質(zhì)量傳送效應(yīng),,,mass transfer,overpotential,,質(zhì)量傳遞過電壓,,,mass transportation,質(zhì)傳,,,master drawing,主圖,;,藍(lán)圖,,,material use factor,材料使用率,,,,mealing,,泡點(diǎn),;,白點(diǎn),,,memory,記憶裝置,,,meniscograph,,solderability,measurement,新月型焊錫效果,,,microetch,,微蝕,,,microetching,,微蝕,,,,microfocus,,微焦距,,,microfocus,system,微焦距系統(tǒng),,,mi

46、croprofile,,微表面,,,,microsectioning,,微切片法,,,microthrowing,power,微分佈力,,,,migration,遷移,,,,mini-tensile tester,迷你拉力測(cè)試儀,,,mis,hole location,孔位錯(cuò)誤,,2024/11/28,15,,misregistration,,焊錫面與零件面對(duì)位偏差,,,misregsitration,,對(duì)不準(zhǔn),,,moisture and insulation resistance test,濕氣與絕緣電阻試驗(yàn),,,molded circuit board (MCB),模製電路板,,,mon

47、oethanal,amine,單乙醇氨,,,monohydrate state,水化物,,,monomer,單分子膜,;,單體,,,,mouse bite,鋸齒,;,蝕刻缺口,,,,msec,毫秒,,,,muffle furnace,高溫焚火爐,,,multichip,超大,IC,型,(多晶片模組),,,,mylar,保護(hù)膜,,,nail head,釘頭,,,NC drill,數(shù)位鑽孔機(jī),,,negative,etchback,,反回蝕,,,negative film,負(fù)片,,,negative rake angle,負(fù)摳耙角,,,network,迴路,;,網(wǎng)路,,,neutralizatio

48、n,中和,,,,nick,缺口,,,,nickel,鎳,,,nodule,銅瘤,;,瘤粒,,no flow resin,不流,,樹脂,,,,noise,雜訊,,,nominal,標(biāo)示,,,,nominal dimension,標(biāo)定長(zhǎng)度,,,nominal gel time,標(biāo)示膠性時(shí)間,,,nominal resin content,標(biāo)示膠含量,,,nominal resin flow,標(biāo)示膠流量,,,nominal scaled flow thickness,標(biāo)示比例流量厚度,,,OA equip,辦公室自動(dòng)化設(shè)備,,obsolescence factor,報(bào)廢因素,,,OEM,原設(shè)備製造商

49、,,,,offset-list,補(bǔ)償數(shù)據(jù)清單,,,ohmmeter,歐姆計(jì),,,open,斷路,,,,open circuits,斷路,,,open short testing,斷短路測(cè)試,,,,2024/11/28,16,,opening,開口,,,,,original art work (A/W),原稿底片,,,,Others,其它,,,,outgrowth,增出,,,,over design,牛刀殺雞,,,,overlap,鑽尖重疊,,,,overlay entry,蓋板,,,overpotential,過電壓,,,,oxidation,氧化,,,,oxide treatment,黑化處

50、理,,,,oxided,,cytochrome,,氧化性之細(xì)包色素,,,oxygen evolution,氧氣發(fā)生反應(yīng),,,packed bed,充填床式,,,pad,錫墊,;,圓配,,,pad copper exposure pad,露銅,,,,panel,小型板面,;,母板,,,,panel plating,一次銅電鍍,,,parasitic,寄生的,,,,part no.,料號(hào),,,pattern plating,二次銅電鍍,,,PCB ( print circuit board ),印刷電路板,,,pcs,,片,,,,peel strength,抗撕強(qiáng)度,,,peeling off,剝

51、離,(,剝落,),,,performance specification,性能規(guī)範(fàn),,,permittivity,透電率,,perspectives on experience,經(jīng)驗(yàn)透視,,,PET,聚酯,,,photodiode detector,發(fā)光二極體偵測(cè)器,,,photo initiator,感光啟始劑,,,photoresist,,光阻,,,phototool,,光具,(,指工作底片,),,,piece,子板面,,,,pinceton,applied research,腐蝕測(cè)定儀,,,pink ring,粉紅圈,,,pit,凹點(diǎn),,,,2024/11/28,17,,pitch,腳距

52、,,,,planar,平面,,,,plating,電鍍,,,plating exposure,下鍍層露出,,,plug gauge,插規(guī),,,,plug hole,孔塞,,,PNL (panel),排板,,,,polar-polar interaction,極性之間的吸力,,,polyester,聚酯類,,,polyglycols,聚乙二醇,,,polyimide,聚亞醯氨,,,poor,bevelling,磨邊加工引起突起,,,剝離,,,poor drill,孔形不良,,,poor HAL,噴錫不良,,,poor marking,字體不良,,,poor pad,錫墊不良,,,poor pri

53、nted,印刷偏差,,,poor,solderability,,焊錫性不良,,,,poor touch-up,補(bǔ)線不良,,,position control system,位置控制系統(tǒng),,,positive rake angle,正摳耙角,,,power curve model,幕次曲線模式,,,practice,工藝慣例,,,preferred,良好,,,,premature tearing,提前撕裂,,,prepolymer,,預(yù)聚合物,,,prepreg,,膠片,,,,pre-process ( front-end),製前,,,,press,壓床,,,press cycle,壓合週期,,

54、,,primary current distribution,一次電流分佈,,primary,主要,,,product lifetimes,生命週期,,,,product process,製程,,,promoter,促進(jìn)劑,,,,protocal,,初步資料,,,prussic acid,普魯士酸,,,PTF-based process,厚膜糊法,,2024/11/28,18,,PTH (plating though hole),導(dǎo)通孔,,,,pull away,拉開,,,,pumice,浮石粉,,,pumice scrub,噴砂清潔法,,,pyrometallurgy,,火燒法冶鍊,,,QC

55、 ( quality control),品管,,,,QFP (quad flat pack ),扁方型封裝體,,,qualification inspection,資格審查檢驗(yàn),,,qualification testing,資格檢定,,quality classification,品質(zhì)等級(jí),,,quantitative,計(jì)量式測(cè)試,,,rack,掛架,,,radiometer,能量劑,,,rake angle,摳耙角,,,RAM [Random Access Memory,隨機(jī)存取記憶體,,real time,關(guān)鍵時(shí)刻,,,,recessed trace process,凹槽線路法,,,re

56、covery tank,回收槽,,,,reduction,還原,,,re-,eninforcement,,強(qiáng)化,,,,refraction,折光率,,reinforcement style,補(bǔ)強(qiáng)材料的型式,,,register mark,對(duì)位用標(biāo)記,,,registration hole,對(duì)位孔,,,registration pattern,長(zhǎng)方形銅地,,,REJ ( reject ),退貨,;,拒收,,,rejectable,,拒收,,,release agent,脫模劑,,,,relief angle,浮離角,,,remark,備註,,,repair,修理,,,resin content,

57、樹脂含量,(,膠含量,),,resin flow,膠流量,,resin flow percentage,樹脂流量之百分率,,,resin recession,樹脂下陷,,,,resin smear,膠渣,,,resist strippers,剝乾膜劑,,2024/11/28,19,,,resistor network,排列電阻,,,resolution,解像度,,return on assets,資產(chǎn)報(bào)酬率,,,reversibility,可逆性,,,rework,重工,,,rosin,天然松香,,,rotating cylinder,旋轉(zhuǎn)圓柱形,,,roughtness,孔壁粗糙,;,粗慥,

58、,,,routing,切外形,,,成型,,,routing bit,銑刀,,,runout,偏轉(zhuǎn),,,S/L on hole,孔內(nèi)沾文字,,,,S/M ( solder mask ), S/L,防焊文字,,,S/M (solder mask),防焊,,,S/M error,防焊種類錯(cuò)誤,,,S/M on hole,孔內(nèi)綠漆,,,salt spray test,鹽水噴霧試驗(yàn),,,sampling size,抽樣數(shù),,scope,範(fàn)圍,,,,scored,刻痕,,,,scoring,樞槽,;,刮線,,,scrap,廢框,,,scratches,刮傷,,,screen printing,網(wǎng)版印刷,,

59、,scum,透明殘膜,,,sealing,封孔處理,,secondary,次要,,,semi-additive,半加成法,,,sensitize,敏化,,,sensitizer,敏化液,,,separator,鋼隔板,,,sequential lamination,漸成式壓法,,,serrated edges,毛邊,,,shatter,破碎,,,2024/11/28,20,,short,短路,,,,shunt,分路,,,,silane,treatment,矽烷處理,,,silicone coupling agent,矽烷偶合劑,,,,silk screen,文字印刷,,,simulator,模

60、擬器,,,,single axis,單軸,,,,sizing,底片之伸縮補(bǔ)償,,,,skip,漏印,,,skip printing,跳印,;,漏印,,,sliver,絲條,,,slot,開槽,,,slotting,開槽,,,SMD ( surface mount device ),表面黏著元件,,,smear,膠渣,,,SMT ( surface mount technology ),表面黏著技術(shù),,sodium carbonate,monohydrate,結(jié)晶水,碳酸鈉,,,soft tooling,軟性工具,,,solder,焊錫,;,錫鉛,,,solder bridge,錫橋,,,so

61、lder bump,錫突,,,solder float,漂錫,,,,solder mask adhesion,綠漆附著力,,,solder on G/F,金手指沾錫,,,solder on trace,線路沾錫,,,solder plug,錫塞,,,solder side,焊錫面,,,solderability,焊錫性,,,solid carbide,實(shí)質(zhì)碳化物,,,spacing,間距,,,,spacing,nonenough,,間距不足,,,SPC ( Statistical Process Control ),統(tǒng)計(jì)生管,,,specification,規(guī)範(fàn),,special consid

62、erations,特別考慮,,,,spin coating,旋轉(zhuǎn)塗佈,,,spindle,鑽軸,,,spiral,contractometer,,螺旋收縮儀,,,spot face,銑靶,,,spray coating,噴塗,,,2024/11/28,21,,Squeegee,刮刀,,,stacking structure,疊板結(jié)構(gòu),,,stamping,沖壓,,,standard hydraulic lamination,標(biāo)準(zhǔn)液壓法,,,standardizing,標(biāo)準(zhǔn)化,,,starvation,缺膠,,,step tablet,格片數(shù),,stock option,認(rèn)股選擇權(quán),,,,str

63、ain,應(yīng)度,,,strength,強(qiáng)度,,,,stressmeter,應(yīng)力計(jì),,,subtractive,減除法,,,surface convex,表面突起,,surface examination,表面檢查,,,,surface insulation resistance (SIR),表面絕緣電阻,,,surface mount,,表面黏著方式,,,surface roughness,表面粗慥度,,,,surges,突波,,,,switch circuit,開關(guān)線路,,,tab,金手指,,,tack free,不黏,,,taped hole gauge,錐形孔規(guī),,,target hole

64、,靶孔,,,,task force,任務(wù)編組,,,tensile strength,抗拉強(qiáng)度,,,tensile stress,張性應(yīng)力,,,tent,浮蓋,,terms and definitions,術(shù)語(yǔ)與定義,,,,,termination load,抗匹配負(fù)載,,,test circuit,測(cè)試線路,,test method,試驗(yàn)方法,,,,test point,測(cè)試點(diǎn),,,,thermal shock,熱震盪試驗(yàn),,,thermal stress,熱應(yīng)力試驗(yàn),,,thermistor,熱電感應(yīng)式,,,thermo cycling,熱循環(huán)試驗(yàn),,,theoretical cycle t

65、ime,理論性週期時(shí)間,,,2024/11/28,22,,thickness,厚度,,,,time to market,上市時(shí)機(jī),,,thickness distribution,厚度分佈,,thief,補(bǔ)助陰極,,thin core,薄基板,;,內(nèi)層板,,throwing power,分佈力,,tolerance,公差,;,容差,,tooling hole,工具孔,,,torque load,扭力拒之負(fù)載,,total quality program,全面的品質(zhì)計(jì)劃,,toughness,堅(jiān)度,,trace error,線路錯(cuò)誤,,trace nick & pin hole,線路缺口及針孔,

66、,trace peeling,線路剝離,,trace pin-hole,線路針孔,,trace surface roughness,線路表面粗糙,,tarnish and oxide resist,抗污抗氧化劑,,transmittance,透光度,,trim line,裁切線,,true,levelling,真平整,,true position,真正位置的孔,;,真位,,twist,板翹,,,type,種類,,,umbra,本影,,undercut,側(cè)蝕,,uneven coating,噴錫厚鍍不平整,,universal,萬用型,,universal tensile tester,萬用拉力試驗(yàn)機(jī),,universal tester,汎用型測(cè)試機(jī),,upper carrier,頂部承載鋼,,uptime,稼動(dòng)時(shí)間,,vacuum deposition,真空蒸鍍法,,vacuum hydraulic lamination,真空液壓法,,vaporizer,氣化室,,V-cut V,形槽,,vertical,microsection,,垂直微切片,20